A few years ago, Synergie Cad achieved a significant milestone when it developed and commercialized a full line of Burn-In systems.

Combined with user-friendly and highly programmable Burn-In drivers, our modular Burn-In systems integrate most functions traditionally found in the most expensive ATE equipment at a fraction of the cost.

PCB designers are in the challenging position of having to find the best solution which meets all of the requirements of the Test Platform, Test Engineers, Manufacturers and Assemblers.
Our design engineers have a broad background and experience in RF Microwave, Electronics, Chemistry, Mechanical engineering and PCB Layout, uBGA, RF, High Speed Digital, Analog, Mixed Signal design Complex board builds, blind, buried, micro vias, multiple laminations and combined materials.
Impedance controlled: Differential, Single ended, Stripline and Surface Microstrip, Embedded Microstrip. Mechanical: Sockets, Shielding, Systems, Custom Stiffeners, Cables.

ANSYS HFSS software is the industry-standard simulation tool for 3-D full-wave electromagnetic field simulation and is essential for the design of high-frequency and high-speed circuit design. It provides accuracy for the design of high-speed circuits, test sockets, PCB interconnects, high-frequency components and RF/microwave components and evaluates signal quality, including transmission path losses, reflection losses due to impedance mismatches, parasitic coupling and radiation. Visualizing 3-D electromagnetic fields is important. ANSYS SIWave is used to analyse complete designs (includes multiple, arbitrarily shaped power/ground layers, vias, signaltraces and circuit elements). We perform complete signal-integrity and power-integrity analysis from DC to beyond 10 GHz.

Synergie Cad Group offers test software development services in addition to the test hardware design and manufacturing. Supported by a dedicated internal team of Engineers we provide Test program solutions for the leading Automated Test Equipment.

Utilising both internal test platforms and 3rd party ATE we support both Final Assembly and Wafer Probe test program development, characterisation, qualification read-point testing as well as platform and pattern conversion.

Cooperation internally between Design, Test and Manufacturing allows us to have complete control over design validation and Test Production improvements.

We support new product introductions, production yield improvements, offshore transfer and legacy testing through our offices and service centers based in Europe, USA and Asia.